Module EC-25

Semiconductor Test, Packaging and Reliability

Everything a semiconductor company does after the wafer is finished. Why two identical designs on the same wafer behave differently and what yield measures, the instruments and structures used to find out what a device actually does, the test that decides which parts are sold and which are scrapped, the package as an electrical and thermal design rather than a lid, the mechanisms that make a working part stop working after three years, and the analysis that finds out why a returned unit failed.